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Effect of higher temperature at metal plate based on thickness and hardness material using ultrasonic testing method

conference contribution
posted on 2025-02-10, 23:15 authored by AAZ Othman, K Ali, D Rifai, NA Rahman, Z Salleh, MA Wahab, RSNAR Aris, JKS Paw, CT Yaw, JD Tan, Talal YusafTalal Yusaf
Non-destructive testing (NDT) comprises various analysis techniques used in science and industry to evaluate material properties without causing harm. NDT finds applications across diverse industries, constantly evolving with new methods. It’s pivotal for assessing remaining wall thickness in objects prone to corrosion or erosion, like vessel and piping. This study supporting the relativity of elevated temperature and thickness measurement in industry. While most measurements occur up to 60 °C with standard procedures, exceptions exist. Industries like refining and chemicals assess component thickness at 60 to 550 °C, where cooling isn’t feasible. Temperature accelerates corrosion, demanding more frequent measurements. This study focuses on material thickness and hardness before and after heating. Stainless steel, alloy, and brass are compared, heating from 100 to 500 °C. Results reveal alloy steel thickness increases by 14.1%, followed by brass at 13.8% and stainless steel at 5.65%. In hardness, stainless steel rises by 23.8%, alloy by 23.58%, and brass by 17.12%. Thermal expansion, tied to bond energy and melting points, influences post-heating changes. Material thickness shifts due to expansion/contraction, while hardness alters due to microstructural shifts. Account for these changes in precise assessments. This effect was taken into account as a parameter relating with performance of thickness measurement.

History

Editor

Triwiyanto T; Rizal A; Caesarendra W

Volume

1182

Start Page

263

End Page

284

Number of Pages

22

Start Date

2023-10-04

Finish Date

2023-10-05

eISSN

1876-1119

ISSN

1876-1100

ISBN-13

9789819714629

Location

Surabaya, Indonesia

Publisher

Springer

Place of Publication

Singapore

Peer Reviewed

  • Yes

Open Access

  • No

Era Eligible

  • Yes

Name of Conference

4th International Conference on Electronics, Biomedical Engineering, and Health Informatics

Parent Title

Proceedings of the 4th International Conference on Electronics, Biomedical Engineering, and Health Informatics: ICEBEHI 2023, 4–5 October, Surabaya, Indonesia

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